Amperion · Toronto
One product · Raising to buildThe copper spine of the megawatt AI rack.
One product, one category of customer, one factory to build. Amperion is engineering the 800 VDC laminated copper interconnect for AI data-centre power — and raising to build the facility that makes it.
The Thesis
Copper, rebuilt for the 800 V era.
NVIDIA is moving 1 MW AI racks to an 800 VDC architecture from 2027. OCP is extending low-voltage DC power up to 1,500 V. Traditional 54 V distribution can't follow.
Amperion is a one-product company for what comes next: the PowerSpine 800 — a compact, validated laminated copper interconnect that moves megawatts through a shelf without arc, hot-spot or partial-discharge risk.
Product 01 · The only product
PowerSpine 800
A passive, touch-safe, serialized DC power-distribution assembly. Two to four shaped copper conductors, laminated with a customer-qualified dielectric stack, terminated to your shelf.
- Nominal voltage
- 800VDC
- Continuous current
- 1.0–1.5kA
- Power transfer
- 0.8–1.2MW
- Conductor layers
- 2–4Cu
Product roadmap
One product now.
Everything else earns its turn.
We ship the PowerSpine 800 first. Every future product is gated by the same rule: paid engineering programmes and a credible production award before capital scale-up.
PowerSpine 800
800 VDC · 1.0–1.5 kA laminated copper interconnect. First deliveries into paid engineering programmes.
PowerSpine 1500
1,500 VDC OCP LVDC variant. Same recipe, extended dielectric stack.
Rack-side DC-link
Purpose-built module for rack-side power units and solid-state transformers.
Custom platform
Customer-specific laminated assemblies leveraging the qualified process.
Manufacturing · Raising now
Financing the factory that makes it.
North America has no specialist facility for validated, high-voltage laminated copper interconnects. We're building it — phased, capital-disciplined, tied to production awards.
- Pre-seed
- C$1.5–2M
- Pilot round
- C$5.5–6M
- Series A
- C$8–12M
Positioning
We are not a copper factory. We are the North American specialist in compact, validated, high-voltage DC power interconnects for the megawatt-computing era.
